In a bold move, Lenovo has introduced an unconventional laptop design at Mobile World Congress (MWC) 2025. The ThinkBook codename Flip AI PC Proof of Concept leverages the same flexible OLED technology seen in Lenovo's rollable devices but presents it in a novel way. This new laptop can transform its 13-inch display into an expansive 18.1-inch screen by folding outwards, offering unprecedented flexibility for multitasking and collaboration. Additionally, the device features a Smart ForcePad with customizable controls, enhancing user interaction beyond traditional touchpads. Despite being an early prototype, the Flip showcases Lenovo's innovative spirit, though challenges remain before it could be ready for market release.
The Flip AI PC concept represents a significant departure from conventional laptops. Instead of retracting the flexible OLED panel within its body, Lenovo opted to fold the screen outward. This ingenious approach allows users to instantly double the display size, providing ample space for document viewing or running multiple applications side-by-side. In vertical mode, this configuration grants extensive real estate for productivity tasks. Alternatively, the screen can be folded back into tablet mode or tent mode, facilitating content sharing across the table. Such versatility is particularly appealing for professionals who require adaptability in their work environments.
One of the standout features of the Flip is its Smart ForcePad, which introduces a multi-layered illuminated dashboard. This advanced interface integrates customizable controls and icons directly onto the touchpad surface, significantly expanding its functionality. While similar innovations have appeared on competing devices, Lenovo's execution adds a fresh twist to user interaction. Inside, the Flip packs robust hardware, including an Intel Core Ultra 7 processor, 32GB of RAM, and PCIe SSD storage, ensuring solid performance for demanding applications.
Despite its promising features, the Flip faces several hurdles before it can become commercially viable. One major issue is the stability of the hinge mechanism. During demonstrations, even a gentle tap caused the entire panel to wobble, raising concerns about durability. Moreover, when the laptop is closed, the folding mechanism exposes the flexible screen to potential scratches, posing a significant risk during transport. Although protective sleeves could mitigate this problem, it underscores the inherent design challenges that Lenovo must address.
At present, Lenovo has no concrete plans to mass-produce the Flip. However, the company’s willingness to showcase such an early prototype highlights its commitment to pushing technological boundaries. Even if the Flip remains a concept, it serves as a testament to Lenovo's creativity and ambition in exploring new possibilities for portable computing. The future of foldable technology may well be shaped by the lessons learned from projects like the Flip AI PC.